Inspection speed of 5,000mm2/sec. which is top class speed in this industry
High resolution of 12μm is realized with the high inspection speed same as a 2D AOI. 3D inspection for the fillet volume of solder and floating of parts is available with the tact time almost same as that of 2D AOI.
Float inspection of tall parts is possible
Multi scanning system enables measurement of the whole measurement range up to 20mm in height at height resolution of 12μm. Even fine float is detectable. Not only lead float of the IC parts but also the fine float of the large parts such as electrolysis condenser and connector.
1 click data creation is possible
Automatic data creation function for major parts such as chips and QFPs to supports the teaching operation with no library data. Time for the data creation can be shortened to less than half compared with the ordinary way.
Specifications
*Please see the table by scrolling horizontally.
| PCBAs to be inspected | M size | ○ |
|---|---|---|
| L size | ○ | |
| Dimensions | 50mm(W)×50mm(D) to 510mm(W)×460mm(D) | |
| Thickness of PCBA | 0.3 to 4.0mm | |
| Maximum weight of PCBA | 3kg | |
| Height limit of PCBA (Clearance) | Upper side | 30mm |
| Under side | 20mm | |
| Resolution | Horizontal resolution：24μm（3D)、12μm（2D) Height resolution：12μm |
|
| Minimum components to be inspected (JIS) | 0603 | |
| Inspection speed | 5,000mm2/s（3D+2D） | |
| Main inspection items | Component inspection | Lifting of lead, lifting of parts, missing parts, displacement, defective standing, polarity, foreign objects, wrong parts, inversion, character recognition (OCR+OCV) |
| Solder inspection | Volume of solder, excess, insufficient, unsoldered, bridges, solder ball |
|
| Imaging range | 49mm (width of scan) | |
| Depth of field | 5mm | |
| Repeatability of positioning | ±7μm | |
| Camera | 12M Pixel | |
| Lighting | RGB + warm white LED | |
| Structure of imaging unit | Optical system with both side telecentric lens | |
| Flow direction of PCBA | Right to Left/Left to right (selected before shipment) |
|
| Driving system of imaging unit | Ball screw biaxial driving | |
| PCBA clamping unit | Air clamp | |
| Width adjustment for transferring conveyor | Automatic | |
| Passline | 920±50mm | |
| Reference position for PCBA width | Front | |
| Monitor | 21.5" touch panel display | |
| PC | OS | Windows 10 Pro 64bit Japanese/English (selected before shipment) |
| Memory | 32GB | |
| Interface between equipments | Conformance to SMEMA standard | |
| Environment conditions for operation | 10 to 35℃/30 to 80%RH (no condensation) | |
| Environment conditions for storage | -10 to 60℃/30 to 80%RH (no condensation) | |
| Power supply | AC200 to 240V ±10%（single phase） 50/60Hz |
|
| Compressed air consumption | Compressed air ：0.5MPa Air consumption ：5Nℓ/min |
|
| Dimensions of main unit (excluding protruding portion) |
W985×D1,100×H1,400mm *in case of the pass line 900mm |
|
| Weight (excluding PC) | 354kg | |
*Please see the table by scrolling horizontally.